The Resource Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng

Label
Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches
Title
Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches
Statement of responsibility
Ryan Knight and Evan Cheng
Creator
Contributor
Author
Issuing body
Subject
Language
eng
http://library.link/vocab/creatorName
Knight, Ryan
Government publication
federal national government publication
Illustrations
illustrations
Index
no index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
  • technical reports
http://library.link/vocab/relatedWorkOrContributorName
  • Cheng, Evan
  • U.S. Army Research Laboratory
Series statement
ARL-TR
Series volume
7094
http://library.link/vocab/subjectName
  • Microelectromechanical systems
  • Microelectronic packaging
  • Semiconductor wafers
Type of report
Final.
Label
Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng
Link
http://purl.fdlp.gov/GPO/gpo61207
Instantiates
Publication
Note
  • Title from title screen (viewed Sept. 29, 2015)
  • "September 2014."
Bibliography note
Includes bibliographical references (page 26)
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Dimensions
unknown
Extent
1 online resource (v, 29 pages)
Form of item
online
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
color illustrations.
Specific material designation
remote
Label
Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng
Link
http://purl.fdlp.gov/GPO/gpo61207
Publication
Note
  • Title from title screen (viewed Sept. 29, 2015)
  • "September 2014."
Bibliography note
Includes bibliographical references (page 26)
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Dimensions
unknown
Extent
1 online resource (v, 29 pages)
Form of item
online
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
color illustrations.
Specific material designation
remote

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