Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng

Resource Information

The instance Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng represents a material embodiment of a distinct intellectual or artistic creation found in Public Libraries of Suffolk County, New York. This resource is a combination of several types including: Instance, Electronic.

Label

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng

Link

http://purl.fdlp.gov/GPO/gpo61207

Statement of responsibility

Ryan Knight and Evan Cheng

Instantiates

• Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches

Publication

• Adelphi, MD, Army Research Laboratory, September 2014

Note

• Title from title screen (viewed Sept. 29, 2015)
• "September 2014."

Bibliography note

Includes bibliographical references (page 26)

Carrier category

online resource

Carrier category code

• cr

Carrier MARC source

rdacarrier

Color

multicolored

Content category

text

Content type code

• txt

Content type MARC source

rdacontent

Dimensions

unknown

Extent

1 online resource (v, 29 pages)

Form of item

online

Media category

computer

Media MARC source

rdamedia

Media type code

• c

Other physical details

color illustrations.

Record ID

.b49753174

Specific material designation

remote